RF-WM-3200B3

RF-WM-3200B3 模块是 RF-Star 推出的一款完全兼容 TI 官方 CC3200MOD 的嵌入式 Wi-Fi模块,具有业界最低的待机功耗;该模块采用 TI Simple-Link Wi-Fi CC3200 芯片设计,内置高 性能 ARM Cortex-M4 处理器,包含多种外设,如:并行摄像头接口,I2S,SD/MMC,UART, SPI,I2C,ADC 和 GPIO。模块支持 IEEE 802.11 b/g/n 无线标准,支持 Station,AP 和 Wi-Fi 直 连模式。模块采用了宽电压 Flash W25Q80BL,模块供电电压范围从 2.3V 到 3.6V,可以使用电池供电。

  • 核心方案: CC3200
  • 支持协议: IEEE 802.11 b/g/n
  • 发射功率: +17dBm
  • 通信距离: 100m
  • 核心优势: 功耗低 兼容TI320MOD

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芯片CC3200RAM256KB(200KB)
尺寸20.5*17.5 mmFlash1MB (MAX:16MB)
天线接口UART/GPIO/SPI
透传与AT指令内核Cortex-M4(32bits)
协议802.11 b/g/n工作频段2400~2483.5MHz
引出IO数28频段2.4 GHz
功耗

模式0: 74mA     模式1: 20mA    

模式2: 1.5mA    模式3: 35μA

传输速率SPI-WiFi: 400KB/S   WiFi: 800KB/S

实测功耗

从不以理论值代替实际值宣传

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模块可在STA模式建立TCP连接

作为Client与远端服务器连接通信

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模块可在STA模式建立TCP Server

并与其他Internet设备连接通信

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模块可在AP模式建立TCP Server

其他Wi-Fi设备在STA模式TCP Client与之相互通信

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原厂可替换

可直接替换原厂CC3200MOD

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支持低功耗

优化后可以将Wi-Fi节点的续航提升至12个月

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实测距离

在天气晴朗 空旷可视 距地约为2米的郊区进行测试

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高低温

能够适应各种恶劣环境

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宽电压

更宽的电压适用范围

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应用场景

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引脚图

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脚位

名称

功能

备注­­

Pin1

GND

-

Ground

Pin2

GND

-

Ground

Pin3

GPIO10

I/O

GPIO

Pin4

GPIO11

I/O

GPIO

Pin5

GPIO14

I/O

GPIO

Pin6

GPIO15

I/O

GPIO

Pin7

GPIO16

I/O

GPIO

Pin8

GPIO17

I/O

GPIO

Pin9

GPIO12

I/O

GPIO

Pin10

GPIO13

I/O

GPIO

Pin11

GPIO22

I/O

GPIO

Pin12

JTAG_TDI

I/O

JTAG TDI input. Leave unconnected if not used on product

Pin13

FLASH_SPI_MISO

I

External Serial Flash Programming: SPI data in

Pin14

FLASH_SPI_nCS_IN

I

External Serial Flash Programming: SPI chip select (active low)

Pin15

FLASH_SPI_CLK

I

External Serial Flash Programming: SPI clock

Pin16

GND

-

Ground

Pin17

FLASH_SPI_MOSI

O

External Serial Flash Programming: SPI data out

Pin18

JTAG_TDO

I/O

JTAG TDO output. Leave unconnected if not used on product

Pin19

GPIO28

I/O

GPIO

Pin20

NC

-

-

Pin21

JTAG_TCK

I/O

JTAG TCK input. Leave unconnected if not used on product.(2)
An internal 100 k
Ω pull down resistor is tied to this pin.

Pin22

JTAG_TMS

-

JTAG TMS input. Leave unconnected if not used on product.

Pin23

SOP2

-

An internal 100 kΩ pull down resistor is tied to this SOP pin. An
external 10 kΩ resistor is required to pull this pin high. See
Section 6.11.1 for SOP[2:0] configuration modes.

Pin24

SOP1

-

An internal 100 kΩ pull down resistor is tied to this SOP pin. An
external 10 kΩ resistor is required to pull this pin high. See
Section 6.11.1 for SOP[2:0] configuration modes.

Pin25

GND

-

Ground

Pin26

GND

-

Ground

Pin27

GND

-

Ground

Pin28

GND

-

Ground

Pin29

GND

-

Ground

Pin30

GND

-

Ground

Pin31

RF_ABG

I/O

Ground

Pin32

GND

-

Ground

Pin33

NC

-

-

Pin34

SOP0

 

An internal 100 kΩ pull down resistor is tied to this SOP pin. An
external 10 kΩ resistor is required to pull this pin high. See
Section 6.11.1 for SOP[2:0] configuration modes.

Pin35

nRESET

I

There is an internal, 100 kΩ, pull-up resistor option from the
nRESET pin to VBAT_RESET. Note: VBAT_RESET is not
connected to VBAT1 or VBAT2 within the module. The following
connection schemes are recommended:
• Connect nRESET to a switch, external controller, or host,
only if nRESET will be in a defined state under all operating
conditions. Leave VBAT_RESET unconnected to save
power.
• If nRESET cannot be in a defined state under all operating
conditions, connect VBAT_RESET to the main module
power supply (VBAT1 and VBAT2). Due to the internal pullup
resistor a leakage current of 3.3 V / 100 kΩ is expected.

Pin36

VBAT_RESET

-

Pin37

VBAT1

Power

Power supply for the module, must be connected to battery (2.3
V to 3.6 V)

Pin38

GND

-

Ground

Pin39

NC

-

-

Pin40

VBAT2

Power

Power supply for the module, must be connected to battery (2.3
V to 3.6 V)

Pin41

NC

-

-

Pin42

GPIO30

 

GPIO

Pin43

GND

 

Ground

Pin44

GPIO30

  

Pin45

NC

-

-

Pin46

GPIO1

I/O

GPIO

Pin47

GPIO2

I/O

GPIO

Pin48

GPIO3

I/O

GPIO

Pin49

GPIO4

I/O

GPIO

Pin50

GPIO5

I/O

GPIO

Pin51

GPIO6

I/O

GPIO

Pin52

GPIO7

I/O

GPIO

Pin53

GPIO8

I/O

GPIO

Pin54

GPIO9

I/O

GPIO

Pin55

GND

-

Thermal ground

Pin56

GND

-

Thermal ground

Pin57

GND

-

Thermal ground

Pin58

GND

-

Thermal ground

Pin59

GND

-

Thermal ground

Pin60

GND

-

Thermal ground

Pin61

GND

-

Thermal ground

Pin62

GND

-

Thermal ground

Pin63

GND

-

Thermal ground

 

 

设计·仿真

良好的性能来源于全局仿真介入

真正的好产品 都是“精打细算”设计而出,强大的设计能力才能做出好产品

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设计·天线

天线是通信系统关键环节

好的天线是通信系统稳定的核心竞争力

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实力认证

九年技术积累 领跑无线行业

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机械尺寸

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引脚定义

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脚位

名称

功能

备注­­

Pin1

GND

-

Ground

Pin2

GND

-

Ground

Pin3

GPIO10

I/O

GPIO

Pin4

GPIO11

I/O

GPIO

Pin5

GPIO14

I/O

GPIO

Pin6

GPIO15

I/O

GPIO

Pin7

GPIO16

I/O

GPIO

Pin8

GPIO17

I/O

GPIO

Pin9

GPIO12

I/O

GPIO

Pin10

GPIO13

I/O

GPIO

Pin11

GPIO22

I/O

GPIO

Pin12

JTAG_TDI

I/O

JTAG TDI input. Leave unconnected if not used on product

Pin13

FLASH_SPI_MISO

I

External Serial Flash Programming: SPI data in

Pin14

FLASH_SPI_nCS_IN

I

External Serial Flash Programming: SPI chip select (active low)

Pin15

FLASH_SPI_CLK

I

External Serial Flash Programming: SPI clock

Pin16

GND

-

Ground

Pin17

FLASH_SPI_MOSI

O

External Serial Flash Programming: SPI data out

Pin18

JTAG_TDO

I/O

JTAG TDO output. Leave unconnected if not used on product

Pin19

GPIO28

I/O

GPIO

Pin20

NC

-

-

Pin21

JTAG_TCK

I/O

JTAG TCK input. Leave unconnected if not used on product.(2)
An internal 100 k
Ω pull down resistor is tied to this pin.

Pin22

JTAG_TMS

-

JTAG TMS input. Leave unconnected if not used on product.

Pin23

SOP2

-

An internal 100 kΩ pull down resistor is tied to this SOP pin. An
external 10 kΩ resistor is required to pull this pin high. See
Section 6.11.1 for SOP[2:0] configuration modes.

Pin24

SOP1

-

An internal 100 kΩ pull down resistor is tied to this SOP pin. An
external 10 kΩ resistor is required to pull this pin high. See
Section 6.11.1 for SOP[2:0] configuration modes.

Pin25

GND

-

Ground

Pin26

GND

-

Ground

Pin27

GND

-

Ground

Pin28

GND

-

Ground

Pin29

GND

-

Ground

Pin30

GND

-

Ground

Pin31

RF_ABG

I/O

Ground

Pin32

GND

-

Ground

Pin33

NC

-

-

Pin34

SOP0

 

An internal 100 kΩ pull down resistor is tied to this SOP pin. An
external 10 kΩ resistor is required to pull this pin high. See
Section 6.11.1 for SOP[2:0] configuration modes.

Pin35

nRESET

I

There is an internal, 100 kΩ, pull-up resistor option from the
nRESET pin to VBAT_RESET. Note: VBAT_RESET is not
connected to VBAT1 or VBAT2 within the module. The following
connection schemes are recommended:
• Connect nRESET to a switch, external controller, or host,
only if nRESET will be in a defined state under all operating
conditions. Leave VBAT_RESET unconnected to save
power.
• If nRESET cannot be in a defined state under all operating
conditions, connect VBAT_RESET to the main module
power supply (VBAT1 and VBAT2). Due to the internal pullup
resistor a leakage current of 3.3 V / 100 kΩ is expected.

Pin36

VBAT_RESET

-

Pin37

VBAT1

Power

Power supply for the module, must be connected to battery (2.3
V to 3.6 V)

Pin38

GND

-

Ground

Pin39

NC

-

-

Pin40

VBAT2

Power

Power supply for the module, must be connected to battery (2.3
V to 3.6 V)

Pin41

NC

-

-

Pin42

GPIO30

 

GPIO

Pin43

GND

 

Ground

Pin44

GPIO30

  

Pin45

NC

-

-

Pin46

GPIO1

I/O

GPIO

Pin47

GPIO2

I/O

GPIO

Pin48

GPIO3

I/O

GPIO

Pin49

GPIO4

I/O

GPIO

Pin50

GPIO5

I/O

GPIO

Pin51

GPIO6

I/O

GPIO

Pin52

GPIO7

I/O

GPIO

Pin53

GPIO8

I/O

GPIO

Pin54

GPIO9

I/O

GPIO

Pin55

GND

-

Thermal ground

Pin56

GND

-

Thermal ground

Pin57

GND

-

Thermal ground

Pin58

GND

-

Thermal ground

Pin59

GND

-

Thermal ground

Pin60

GND

-

Thermal ground

Pin61

GND

-

Thermal ground

Pin62

GND

-

Thermal ground

Pin63

GND

-

Thermal ground

标签: CC3200 Wi-Fi 2.4G
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